Thermal Conductive Adhesive, Epoxy Based (Part Numbers)

Thermal Conductive Adhesive, Epoxy Based
Solvent-free and thermal conductive two part adhesive
epoxy based filled with aluminium oxide
composition of hardener and resin (1:1) with statical mixing tube
lockability of the container via Luer-Lock System
good usage and working properties
store cool and dry

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WLK DK 4
WLK DK 10
WLK DK 50
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Basic information

Thermal Conductivity(W/m·K) 1 Temperature Range -50 to +145 Volume Resistance 8·10^11 Ω/cm
Specific Thermal Resistance 118°C cm/W Hardening Time 60°C approx. 4 h/25°C approx. 16 h Mixture Proportion 1:1

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