[Clean & Pack] Low Head Shoulder Screw(Lista de números de peça: página 2)

Type		D Tolerance	Body Material		Cleaning Method
L dimension selectable / F dimension fixed	L, F Configurable		[M] Material	Strength Class	Cleaning Method	Cleaning Environment	Packaging Type	Packing Environment
SL-LSMSB	SL-FSMSB	e9	EN 1.4301 Equiv.		Degreasing	General environment	Anti-rust packing	General environment
SH-LSMSB	SH-FSMSB			A2−50	Precision cleaning	Class 1,000*	Degassing double packing	Class 10**
SHD-LSMSB	SHD-FSMSB				Electrolytic polishing + precision cleaning
SL-LSMSBG	SL-FSMSBG	g6	EN 1.4301 Equiv.		Degreasing	General environment	Anti-rust packing	General environment
SH-LSMSBG	SH-FSMSBG			A2−50	Precision cleaning	Class 1,000*	Degassing double packing	Class 10**
SHD-LSMSBG	SHD-FSMSBG				Electrolytic polishing + precision cleaning
SL-LSMSBH	SL-FSMSBH	h7	EN 1.4301 Equiv.		Degreasing	General environment	Anti-rust packing	General environment
SH-LSMSBH	SH-FSMSBH			A2−50	Precision cleaning	Class 1,000*	Degassing double packing	Class 10**
SHD-LSMSBH	SHD-FSMSBH				Electrolytic polishing + precision cleaning

*US FED STD 209E, ISO 14644-1 ISO 6 Equiv.
**US FED STD 209E, ISO 14644-1 ISO 4 Equiv.
[ ! ] Products are packed by order quantity. Ex. If the order is for 20 pieces, they are packed in one package (incl. 20 pieces).
[ ! ] See the details of degreasing, precision cleaning, and electrolytic polishing shown at the bottom of the specification table.

◦ L Dimension Selectable / F Dimension Fixed

Part Number	—	L
SL-LSMSBG4	—	20

○ L, F Dimension Configurable

Part Number	—	L	—	F
SH-FSMSB4.5	—	30.5	—	4

■L/F Configurable

Part Number		L	F	L + F Machining Conditions	D Tolerance			A	B	C	E	M × P	T
Type	D	0.1 mm Increments	1 mm Increments		e9	g6	h7
e9 SL-FSMSB SH-FSMSB SHD-FSMSB g6 SL-FSMSBG SH-FSMSBG SHD-FSMSBG h7 SL-FSMSBH SH-FSMSBH SHD-FSMSBH	4	10 to 40	M ≤ F ≤ M × 3	L+F ≤ 45	−0.020	−0.004	0	6.5	2.5	1.6	2	2.5 × 0.45	4.5
					−0.050	−0.012	−0.012
	4.5	10 to 40		L+F ≤ 46	−0.020	−0.004	0	7	2.5	1.6	2	3 × 0.5	5.0
					−0.050	−0.012	−0.012
	5	10 to 40		L+F ≤ 46	−0.020	−0.004	0	8	2.5	1.6	2	3 × 0.5	5.5
					−0.050	−0.012	−0.012
	5.5	10 to 40		L+F ≤ 47	−0.020	−0.004	0	9	3	2.2	2.5	4 × 0.7	6.0
					−0.050	−0.012	−0.012
	6	10 to 40		L+F ≤ 47	−0.020	−0.004	0	9	3	2	2.5	4 × 0.7	6.5
					−0.050	−0.012	−0.012
	6.5	10 to 50		L+F ≤ 59	−0.025	−0.005	0	10	4	2.5	3	5 × 0.8	7.0
					−0.061	−0.014	−0.015
	8	10 to 60		L+F ≤ 70	−0.025	−0.005	0	13	5	3	4	6 × 1.0	8.7
					−0.061	−0.014	−0.015
	10	10 to 60		L+F ≤ 72	−0.025	−0.005	0	16	6	4	5	8 × 1.25	10.8
					−0.061	−0.014	−0.015

				Working Environment: Class 1,000*				Working Environment: Class 10**
Hydrocarbon cleaning Ro water cleaning		Wash with pure water (10 MΩ·cm) after high-pressure water jet cleaning (Ro water)		Use pure water (13 MΩ·cm)		Use nitrogen blow		Conducted on a clean bench in a Class 10** clean environment

*US FED STD 209E, ISO 14644-1 ISO 6 Equiv.
**US FED STD 209E, ISO 14644-1 ISO 4 Equiv.

						Working Environment: Class 1,000*				Working Environment: Class 10**
Hydrocarbon cleaning Ro water cleaning		Electrolytic polishing with an electrolytic polishing layer according to the material		Wash with pure water (10 MΩ·cm) after high-pressure water jet cleaning (Ro water)		Use warm pure water (13 MΩ·cm)		Use nitrogen blow		Conducted on a clean bench in a Class 10** clean environment

*US FED STD 209E, ISO 14644-1 ISO 6 Equiv.
**US FED STD 209E, ISO 14644-1 ISO 4 Equiv.

Cleaning Effectiveness / Recommended Environment for Use

Cleaning Method	Product Part Number	Packaging Type	Effects Compared to Uncleaned Product	Environment (Standard)	Possible applications
Degreasing	SL-□□	Anti-rust packing	Oil removal	General environment	Regular assembly process
					Post battery assembly process
Precision cleaning	SH-□□	Degassing double packing	Oil removal Dust removal	Clean environment (Class 10 to 1,000*)	Battery assembly process
					LCD-related post assembly process
					In-vehicle camera assembly process
Electrolytic polishing + precision cleaning	SHD-□□	Degassing double packing	Oil removal Dust removal Outgas reduction	Vacuum environment Clean environment (Class 10 to 1,000*)	Pre-semiconductor process
					Liquid crystal deposition process
					Pre-OLED process

*US FED STD 209E, ISO 14644-1 ISO 4 to ISO 6 Equiv.